Germanium hump reduction

ABSTRACT

The present disclosure provides methods of forming semiconductor devices. A method according to the present disclosure includes receiving a workpiece that includes a stack of semiconductor layers, depositing a first pad oxide layer on a germanium-containing top layer of the stack, depositing a second pad oxide layer on the first pad oxide layer, depositing a pad nitride layer on the second pad oxide layer, and patterning the stack using the first pad oxide layer, the second pad oxide layer, and the pad nitride layer as a hard mask layer. The depositing of the first pad oxide layer includes a first oxygen plasma power and the depositing of the second pad oxide layer includes a second oxygen plasma power greater than the first oxygen plasma power.

BACKGROUND

The semiconductor integrated circuit (IC) industry has experiencedexponential growth. Technological advances in IC materials and designhave produced generations of ICs where each generation has smaller andmore complex circuits than the previous generation. In the course of ICevolution, functional density (i.e., the number of interconnecteddevices per chip area) has generally increased while geometry size(i.e., the smallest component (or line) that can be created using afabrication process) has decreased. This scaling down process generallyprovides benefits by increasing production efficiency and loweringassociated costs. Such scaling down has also increased the complexity ofprocessing and manufacturing ICs.

For example, as integrated circuit (IC) technologies progress towardssmaller technology nodes, multi-gate metal-oxide-semiconductor fieldeffect transistor (multi-gate MOSFET, or multi-gate devices) have beenintroduced to improve gate control by increasing gate-channel coupling,reducing off-state current, and reducing short-channel effects (SCEs). Amulti-gate device generally refers to a device having a gate structure,or portion thereof, disposed over more than one side of a channelregion. Fin-like field effect transistors (FinFETs) andmulti-bridge-channel (MBC) transistors are examples of multi-gatedevices that have become popular and promising candidates for highperformance and low leakage applications. A FinFET has an elevatedchannel wrapped by a gate on more than one side (for example, the gatewraps a top and sidewalls of a “fin” of semiconductor material extendingfrom a substrate). An MBC transistor has a gate structure that canextend, partially or fully, around a channel region to provide access tothe channel region on two or more sides. Because its gate structuresurrounds the channel regions, an MBC transistor may also be referred toas a surrounding gate transistor (SGT) or a gate-all-around (GAA)transistor. The channel region of an MBC transistor may be formed fromnanowires, nanosheets, other nanostructures, and/or other suitablestructures.

Formation of MBC transistors involves patterning an epitaxial layerstack into a fin-shaped structure. In instances where a top layer of theepitaxial layer stack is a germanium-containing layer, such as a silicongermanium layer, the germanium content in the top layer may formprotrusive humps during deposition of a hard mask layer. The protrusivehumps may result in nonuniformed fin-shaped structures due todelamination of the hard mask layer or nonhomogeneous compositions inthe top layer. Therefore, while existing processes to form MBCtransistors are generally adequate for their intended purposes, they arenot satisfactory in all aspects.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure is best understood from the following detaileddescription when read with the accompanying figures. It is emphasizedthat, in accordance with the standard practice in the industry, variousfeatures are not drawn to scale and are used for illustration purposesonly. In fact, the dimensions of the various features may be arbitrarilyincreased or reduced for clarity of discussion.

FIG. 1 illustrates a flowchart of a method for forming a semiconductordevice, according to one or more aspects of the present disclosure.

FIGS. 2-13 illustrate fragmentary cross-sectional views of a workpieceduring a fabrication process according to the method of FIG. 1,according to one or more aspects of the present disclosure.

FIG. 14 illustrates change of process temperature over process time inan example deposition process for operations at block 108 of the methodin FIG. 1, according to one or more aspects of the present disclosure.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the invention. Specificexamples of components and arrangements are described below to simplifythe present disclosure. These are, of course, merely examples and arenot intended to be limiting. For example, the formation of a firstfeature over or on a second feature in the description that follows mayinclude embodiments in which the first and second features are formed indirect contact and may also include embodiments in which additionalfeatures may be formed between the first and second features, such thatthe first and second features may not be in direct contact. In addition,spatially relative terms, for example, “lower,” “upper,” “horizontal,”“vertical,” “above,” “over,” “below,” “beneath,” “up,” “down,” “top,”“bottom,” etc. as well as derivatives thereof (e.g., “horizontally,”“downwardly,” “upwardly,” etc.) are used for ease of the presentdisclosure of one features relationship to another feature. Thespatially relative terms are intended to cover different orientations ofthe device including the features. Furthermore, when a number or a rangeof numbers is described with “about,” “approximate,” and the like, theterm is intended to encompass numbers that are within a reasonable rangeconsidering variations that inherently arise during manufacturing asunderstood by one of ordinary skill in the art. For example, the numberor range of numbers encompasses a reasonable range including the numberdescribed, such as within +/−10% of the number described, based on knownmanufacturing tolerances associated with manufacturing a feature havinga characteristic associated with the number. For example, a materiallayer having a thickness of “about 5 nm” can encompass a dimension rangefrom 4.25 nm to 5.75 nm where manufacturing tolerances associated withdepositing the material layer are known to be +/−15% by one of ordinaryskill in the art. Still further, the present disclosure may repeatreference numerals and/or letters in the various examples. Thisrepetition is for the purpose of simplicity and clarity and does not initself dictate a relationship between the various embodiments and/orconfigurations discussed.

The present disclosure is generally related to methods of forming MBCtransistors, and more particularly to methods of forming a fin-shapedstructure from a stack that includes a germanium-containing top layer.

Multi-gate devices include transistors whose gate structures are formedon at least two-sides of a channel region. Examples of multi-gatedevices include fin-like field effect transistors (FinFETs) havingfin-like structures and MBC transistors having a plurality of a channelmembers. As described above, MBC transistors may also be referred to asSGTs, GAA transistors, nanosheet transistors, or nanowire transistors.An MBC transistor includes any device that has its gate structure, orportion thereof, formed on 4-sides of a channel region (e.g.,surrounding a portion of a channel region). MBC devices according to thepresent disclosure may have channel regions disposed in nanowire channelmembers, bar-shaped channel members, nanosheet channel members,nanostructure channel members, column-shaped channel members,post-shaped channel members, and/or other suitable channelconfigurations. MBC transistors may be either n-type or p-type.

Formation of an MBC transistor includes formation of a fin-shapedstructure from a stack of semiconductor layers. Such a stack mayinclude, for example, a plurality of silicon layers and a plurality ofgermanium-containing layers. In some examples, the stack may beconfigured to have a germanium-containing layer as a topmost layer tomeet various design requirements. Such design requirements may includeprevention of damages to the topmost channel members, formation ofp-type MBC transistors, or yield improvement. To pattern the stack toform the fin-shaped structure, a hard mask layer is formed on thetopmost layer. When the topmost layer includes germanium and the hardmask layer includes silicon oxide or silicon nitride, germanium humps(or germanium bumps) may be formed at the interface between the topmostlayer and the hard mask layer. Such germanium humps may coalesce andgain in dimensions. It is observed that germanium humps may causedelamination of the hard mask layer, voids in the topmost layer, ornonuniform etching of the stack, which may lead to defects and reducedyield.

The present disclosure provides methods of forming MBC transistors withan improved yield. Such methods may include forming a pad oxide layerusing a low-level of oxygen plasma, forming a pad nitride layer usingplasma-enhanced atomic layer deposition (PEALD) or plasma-enhancedchemical vapor deposition (PECVD) at a low temperature between about350° C. and about 450° C., or a combination thereof. Use of low-leveloxygen plasma may minimize the generation of germanium oxide, which is areactant in a reduction chemical reaction to form germanium. The lowtemperature during the formation of the pad nitride layer may slow downthe reduction chemical reaction of germanium oxide to form germanium. Bylessening germanium oxide formation and/or slowing down the reductionreaction of germanium oxide, method of the present disclosure may reducethe number of germanium humps or reduce the dimensions of germaniumhumps, thereby improving uniformity of fin-shaped structures and overallyield.

The various aspects of the present disclosure will now be described inmore detail with reference to the figures. In that regard, FIG. 1 is aflowchart illustrating a method 100 of forming a semiconductor devicefrom a workpiece according to embodiments of the present disclosure.Method 100 is merely an example and is not intended to limit the presentdisclosure to what is explicitly illustrated in method 100. Additionalsteps can be provided before, during and after the method 100, and somesteps described can be replaced, eliminated, or moved around foradditional embodiments of the method. Not all steps are described hereinin detail for reasons of simplicity. Method 100 is described below inconjunction with FIG. 2-13, which are fragmentary cross-sectional viewsof a workpiece 200 at different stages of fabrication according toembodiments of the method 100 in FIG. 1. For avoidance of doubts, the X,Y and Z directions in FIGS. 2-13 are perpendicular to one another andare used consistently throughout FIGS. 2-13. Because the workpiece 200will be fabricated into a semiconductor device, the workpiece 200 may bereferred to herein as a semiconductor device 200 as the context requires

Referring to FIGS. 1 and 2, method 100 includes a block 102 where aworkpiece 200 is provided. As shown in FIG. 2, the workpiece 200includes a substrate 202 and a stack 204 of semiconductor layers. Insome embodiments, the substrate 202 may be a semiconductor substratesuch as a silicon substrate. The substrate 202 may include variousdoping configurations depending on design requirements as is known inthe art. Depending on the type of devices to be formed on the substrate202, the substrate 202 may include an n-type doping profile (i.e., ann-type well or n-well) or a p-type doping profile (i.e., a p-type wellor p-well). N-type dopant(s) for forming the n-type well may includephosphorus (P), arsenic (As), or antimony (Sb). P-type dopant(s) forforming the p-type well may include gallium (Ga) or boron (B). Thesuitable doping may include ion implantation of dopants and/or diffusionprocesses. The substrate 202 may also include other semiconductors suchas germanium, silicon carbide (SiC), silicon germanium (SiGe), ordiamond. Alternatively, the substrate 202 may include a compoundsemiconductor and/or an alloy semiconductor. Further, the substrate 202may optionally include an epitaxial layer, may be strained forperformance enhancement, may include a silicon-on-insulator (SOI) or agermanium-on-insulator (GeOI) structure, and/or may have other suitableenhancement features.

In some embodiments, the stack 204 includes sacrificial layers 206 of afirst semiconductor composition interleaved by channel layers 208 of asecond semiconductor composition. The first and second semiconductorcomposition may be different. In some embodiments, the sacrificiallayers 206 include silicon germanium (SiGe) and the channel layers 208include silicon (Si). In some alternative embodiments, the sacrificiallayers 206 include silicon germanium (SiGe) and the channel layers 208include germanium (Ge). In still other embodiments, both sacrificiallayers 206 and the channel layers 208 include silicon germanium and agermanium content of the sacrificial layers 206 is greater than agermanium content of the channel layers 208. As shown in FIG. 2, besidesthe sacrificial layers 206 and channel layers 208, the stack 204 furtherincludes a top layer (or a topmost layer) 2060. The top layer 2060includes germanium. In some instances, a composition of the top layer2060 may be similar, or identical, to a composition of the sacrificiallayers 206. In one embodiment, the top layer 2060 include silicongermanium (SiGe). It is noted that three (3) layers of the sacrificiallayers 206 and three (3) layers of the channel layers 208 arealternately arranged as illustrated in FIG. 2, which is for illustrativepurposes only and not intended to be limiting beyond what isspecifically recited in the claims. It can be appreciated that anynumber of epitaxial layers may be formed in the stack 204. The number oflayers depends on the desired number of channels members for thesemiconductor device 200. In some embodiments, the number of channellayers 208 is between 2 and 10.

In some embodiments, all sacrificial layers 206 may have a substantiallyuniform first thickness and all of the channel layers 208 may have asubstantially uniform second thickness. The first thickness and thesecond thickness may be identical or different. As described in moredetail below, the channel layers 208 or parts thereof may serve aschannel member(s) for a subsequently-formed multi-gate device and thethickness of each of the channel layers 208 is chosen based on deviceperformance considerations. The sacrificial layers 206 in channelregions(s) may eventually be removed and serve to define a verticaldistance between adjacent channel region(s) for a subsequently-formedmulti-gate device and the thickness of each of the sacrificial layers206 is chosen based on device performance considerations. Like thesacrificial layers 206, the top layer 2060 also serves as a sacrificiallayer to protect the topmost channel layer 208. The top layer 2060 has athird thickness. Depending on process parameters and the level ofprotection intended for the channel layers 208, the third thickness maybe smaller than or greater than the first thickness.

The layers in the stack 204 may be deposited using a molecular beamepitaxy (MBE) process, a metalorganic chemical vapor deposition (MOCVD)process, and/or other suitable epitaxial growth processes. As statedabove, in at least some examples, each of the sacrificial layers 206includes an epitaxially grown silicon germanium (SiGe) layer, each ofthe channel layers 208 includes an epitaxially grown silicon (Si) layer,and a composition of the top layer 2060 may be similar, or identical, toa composition of the sacrificial layers 206. The top layer 2060 In someembodiments, the sacrificial layers 206 and the channel layers 208 aresubstantially dopant-free (i.e., having an extrinsic dopantconcentration from about 0 cm⁻³ to about 1×10¹⁷ cm⁻³), where forexample, no intentional doping is performed during the epitaxial growthprocesses for the stack 204.

Referring to FIGS. 1 and 3, method 100 includes a block 104 where afirst pad layer 302 is deposited over the stack 204. The first pad layer302 includes silicon oxide and may be referred to as a first pad oxidelayer 302. In the depicted embodiment, the first pad layer 302 may bedeposited using a first plasma-enhanced atomic layer deposition (PEALD)process 402. In an example first PEALD process 402, a silicon-containingprecursor, such as silane (SiH₄), and an oxygen-containing precursor,such as oxygen (O₂), are alternatingly supplied in an PEALD chamberwhere the workpiece 200 is situated. In some instances, the processtemperature of the first PEALD process 402 to form the first pad layer302 is between about 200° C. and about 300° C. In the first PEALDprocess 402, the oxygen-containing precursor, such as oxygen, may besupplied in the form of inductively coupled radio oxygen plasma,capacitively coupled plasma, or remotely generated plasma. The firstPEALD process 402 is configured to reduce oxidation of the germaniumcontent in the top layer 2060. As compared to the second PEALD process404 to form a second pad layer 304 at block 106 (to be described below),the first PEALD process 402 at block 104 includes a low level (LL) ofradio-frequency (RF) plasma power when the oxygen-containing precursoris supplied to the PEALD chamber. In some instances, such a low level(LL) of RF plasma power is between about 150 Watts (W) and about 400 W.In this range of low-level RF plasma power, 150 W is about the lowestpower available for commercially available PEALD equipment. With respectto the upper bound-400 W, it is observed when the RF plasma powerexceeds 400 W, it is more likely than not that too much germanium oxidemay be formed. As shown in FIG. 3, the first pad layer 302 may have afirst thickness T1 along the Z direction and the first thickness T1 isbetween about 8 Å and about 12 Å.

Referring to FIGS. 1 and 4, method 100 includes a block 106 where asecond pad layer 304 is deposited on the first pad layer 302. The secondpad layer 304 includes silicon oxide and may be referred to as a secondpad oxide layer 304. In the depicted embodiment, the second pad layer304 may be deposited using a second PEALD process 404. In an examplesecond PEALD process 404, a silicon-containing precursor, such as silane(SiH₄), and an oxygen-containing precursor, such as oxygen (O₂), arealternatingly supplied in an PEALD chamber where the workpiece 200 issituated. In some instances, the process temperature of the second PEALDprocess 404 to form the second pad layer 304 is between about 200° C.and about 300° C. In the second PEALD process 404, the oxygen-containingprecursor, such as oxygen, may be supplied in the form of inductivelycoupled radio oxygen plasma, capacitively coupled plasma, or remotelygenerated plasma. As compared to the first PEALD process to form thefirst pad layer 302 at block 104, the second PEALD process 404 at block106 includes a high level (HL) of RF plasma power when theoxygen-containing precursor is supplied to the PEALD chamber. The highlevel (HL) of RF plasma power at block 106 may be about 2 time and about3 times of the low level (LL) of RF plasma power at block 104. That is,a ratio (HL/LL) of the high level (HL) of RF plasma power at block 106to the low level (LL) of RF plasma power at block 104 may be betweenabout 2 and about 3. It is observed that if the high level (HL) of RFplasma power at block 106 is less than 2 time of the low level (LL) ofRF plasma power at block 106, the quality of the second pad layer 304may not be sufficient. However, a high level (HL) greater than 3 time ofthe low level (LL) does not yield additional benefits in terms of theetch resistance. In some instances, such a high level (HL) of RF plasmapower is between about 550 Watts (W) and about 800 W. This range ofhigh-level RF plasma power is selected to form a dense, high-quality,and etch resistant silicon oxide layer. As shown in FIG. 4, the secondpad layer 304 may include a second thickness T2 along the Z directionand the second thickness T2 is between about 8 Å and about 12 Å.

Between the first pad layer 302 and the second pad layer 304, the firstpad layer 302 is of a lower quality than the second pad layer 304 atleast in terms of etch resistance. It is observed that DHF (dilutedhydrogen fluoride) etches a 20 Å-thick of the first pad layer 302 (lowerquality) at a rate about 280 nm/minute to about 320 nm/minute but etchesa 20 Å-thick of the second pad layer 304 (higher quality) at a rateabout 65 nm/minute to about 75 nm/minute. In this regard, the first padlayer 302 may also be referred to as a high-quality pad oxide layer 302and the second pad layer 304 may also be referred to as a low-qualitypad oxide layer 304. When only the first pad layer 302 is formed to atotal thickness of the first thickness T1 and the second thickness T2,it may not provide sufficient etch resistance and lead to defects. Thisis why low-quality pad oxide layer, such as the first pad layer 302, isnot used in some conventional technology because its fast etch ratedisqualifies it as part of a hard mask layer. However, as describedabove, when only the second pad layer 304 is formed to a total thicknessof the first thickness T1 and the second thickness T2, the high level RFplasma power may lead to excessive germanium oxide. To address thisdilemma identified in the present disclosure, a series of experiments isconducted. According to these experiments, when a ratio of the firstthickness T1 to the second thickness T2 is about 1:1, etch resistance ofthe combination of the first pad layer 302 and the second pad layer 304rivals etch resistance of the second pad layer 304 of a total thicknessof the first thickness T1 and the second thickness T2. For example, DHFetches a combination of a 10 Å-thick first pad layer 302 and a 10Å-thick second pad layer 302 at about 70 nm/minute.

Referring to FIGS. 1 and 5, method 100 includes a block 108 where athird pad layer 306 is deposited. In some embodiments, the third padlayer 306 includes silicon nitride and may be referred to as a padnitride layer 306. The deposition of the third pad layer 306 isconfigured to introduce minimal thermal energy. By way of example, theprocess temperature and process time of the deposition of the third padlayer 306 is illustrated in FIG. 14. In some embodiments, the third padlayer 306 is deposited using PECVD or plasma-enhanced atomic layerdeposition (PEALD). As shown in FIG. 14, the process temperature atblock 108 may be ramped up from about room temperature (i.e., roomtemp.) to a steady-state temperature T (i.e., process temperature T) andthen ramped back down to room temperature within a process time (i.e.,duration) D. In some implementations, the process temperature T may bebetween about 350° C. and about 450° C. and the process time D may bebetween about 25 minutes and about 35 minutes. Such a processtemperature T is much lower than the temperature required to deposit thethird pad layer 306 using CVD, which is between about 500° C. and about600° C. Further, in embodiments where the third pad layer 306 isdeposited using PECVD or PEALD. Such a process time T is a lot less thanthe process time required to deposit the third pad layer 306 using CVD,which is between about 3 hours and 5 hours. It can be seen that, byemploying a lower process temperature T and a shorter process time D,the deposition of the third pad layer 306 at block 108 introduce lessthermal energy to the workpiece.

While method 100 in FIG. 1 includes blocks 104, 106 and 108, variousalternative embodiments are possible. One of the intended purpose ofmethod 100 is to reduce the number or dimensions of germanium humps thatextend from the top layer 2060 into the first pad layer 302 or even intothe second pad layer 304. The formation of such germanium humps may bebroken down into two stages—an oxidation stage followed by a reductionstage. The oxidation stage may be described by the following chemicalequation (1):SiGe+O₂ (plasma)→SiO₂+GeO₂+SiGeO₂  (1)The reduction stage may be described by the following chemical equation(2):

In chemical equation (1), when the top layer 2060 includes silicongermanium (SiGe), silicon germanium may be oxidized in the oxygen plasmato produce silicon dioxide (SiO₂), germanium oxide (GeO₂), and silicongermanium oxide (SiGeO₂). In chemical equation (2), germanium oxide(GeO₂) and silicon germanium oxide (SiGeO₂) may be reduced to formgermanium and the reduction reaction requires thermal energy (i.e.,heat). Germanium precipitation (in the form of germanium dots) fromchemical equation (2) may merge to form germanium humps (or germaniumparticles) and as the precipitation continues, the germanium humps maygrow in size. Over time, the composition of the top layer 2060 maychange and become less uniform. Nonuniformity of the top layer 2060 maylead to defects when the top layer 2060 is used in patterning the stack204. In one aspect, operations at block 104 is designed to decreaseproduction of germanium oxide (GeO₂) in chemical equation (1) byreducing the radio frequency (RF) power of the oxygen plasma. In anotheraspect, operations at block 108 are designed to decrease thermal energy(i.e., heat) input to drive the reduction reaction (2) to the right-handside. By using PEALD or PECVD, block 108 employs lower processtemperature between about 350° C. and about 450° C. and lasts for ashorter process time between about 25 minutes and about 35 minutes.While inclusion of both blocks 104 and 108 reduces the numbers anddimensions of germanium humps, reduction of germanium humps does notrequire all of them. It is observed that a first alternative embodimentof method 100 may reduce the numbers and dimensions of germanium humpsif it includes block 108 but omits block 104. Similarly, a secondalternative embodiment of method 100 may reduce the numbers anddimensions of germanium humps if it includes block 104 but omits block108.

In a first alternative embodiment, block 104 is omitted and the secondpad layer 304 at block 106 of method 100 is formed to a combinedthickness of the first thickness T1 and the second thickness T2, whichis between about 16 Å and about 24 Å. In this first alternativeembodiment, while germanium oxide (GeO₂) is produced in chemicalequation (1), block 108 operates to reduce thermal energy input inchemical equation (2), thereby decreasing germanium generation. In asecond alternative embodiment, block 108 of method 100 may be replacedby deposition of a CVD silicon nitride layer at a process temperaturebetween about 500° C. and about 600° C. and for a duration between about3 hours and about 5 hours. In the second alternative embodiment, whilethermal energy is input in the chemical equation (2) during thedeposition of the CVD silicon nitride layer to drive the reaction to theright-hand side, block 104 operates to decrease germanium oxide (GeO₂),a reactant of chemical equation (2). Flowcharts consistent with thefirst alternative embodiment and the second alternative embodiments arenot separately illustrated for brevity.

Referring to FIGS. 1, 5, 6, and 7, method 100 includes a block 110 wherea fin-shaped structure 210 is formed from the stack 204 and thesubstrate 202. The first pad layer 302, the second pad layer 304 and thethird pad layer 306 shown in FIG. 5 collectively constitute a hard masklayer 310. Because the hard mask layer 310 is used to pattern thefin-shaped structure 210, the hard mask layer 310 may also be referredto as a fin-top hard mask layer 310. The fin-shaped structure 210 may bepatterned from the stack 204 and the substrate 202 using a lithographyprocess and an etch process. The lithography process may includephotoresist coating (e.g., spin-on coating), soft baking, mask aligning,exposure, post-exposure baking, photoresist developing, rinsing, drying(e.g., spin-drying and/or hard baking), other suitable lithographytechniques, and/or combinations thereof. In some embodiments, the etchprocess may include dry etching (e.g., RIE etching), wet etching, and/orother etching methods. As shown in FIG. 6, the etch process at block 110forms trenches extending through the stack 204 and a portion of thesubstrate 202. The trenches define the fin-shaped structures 210 (oneshown in FIG. 6). In some implementations, double-patterning ormulti-patterning processes may be used to define fin-shaped structuresthat have, for example, pitches smaller than what is otherwiseobtainable using a single, direct photolithography process. For example,in one embodiment, a material layer is formed over a substrate andpatterned using a photolithography process. Spacers are formed alongsidethe patterned material layer using a self-aligned process. The materiallayer is then removed, and the remaining spacers, or mandrels, may thenbe used to pattern the fin-shaped structure 210 by etching the stack204. As shown in FIG. 6, the fin-shaped structure 210, along with thesacrificial layers 206 and the channel layers 208 therein, extendslengthwise along the X direction.

As illustrated in FIG. 7, at block 110, an isolation feature 212 may beformed adjacent the base of the fin-shaped structure 210. In someembodiments, the isolation feature 212 may be formed in the trenches toisolate the fin-shaped structures 210 from a neighboring active region(not explicitly shown). The isolation feature 212 may also be referredto as a shallow trench isolation (STI) feature 212. By way of example,in some embodiments, a dielectric layer is first deposited over thesubstrate 202, filling the trenches with the dielectric layer. In someembodiments, the dielectric layer may include silicon oxide, siliconnitride, silicon oxynitride, fluorine-doped silicate glass (FSG), alow-k dielectric, combinations thereof, and/or other suitable materials.In various examples, the dielectric layer may be deposited by a CVDprocess, a subatmospheric CVD (SACVD) process, a flowable CVD process,and/or other suitable process. The deposited dielectric material is thenthinned and planarized, for example by a chemical mechanical polishing(CMP) process. The planarized dielectric layer is further recessed orpulled-back by a dry etching process, a wet etching process, and/or acombination thereof to form the STI feature 212. The fin-shapedstructure 210 rises above the STI feature 212 after the recessing.

Referring to FIGS. 1, 8 and 9, method 100 includes a block 112 where adummy gate stack 220 is formed over a channel region 210C of thefin-shaped structure 210. In some embodiments, a gate replacementprocess (or gate-last process) is adopted where the dummy gate stack 220(shown in FIG. 9) serves as a placeholder to undergo various processesand is to be removed and replaced by the functional gate structure.Other processes and configuration are possible. In some embodimentsillustrated in FIG. 9, the dummy gate stack 220 is formed over thefin-shaped structure 210 and the fin-shaped structure 210 may be dividedinto channel regions 210C underlying the dummy gate stacks 220 andsource/drain regions 210SD that do not underlie the dummy gate stacks220. The channel regions 210C are adjacent the source/drain regions210SD. As shown in FIG. 9, the channel region 210C is disposed betweentwo source/drain regions 210SD.

The formation of the dummy gate stack 220 may include deposition oflayers in the dummy gate stack 220, shown in FIG. 8, and patterning ofthese layers, shown in FIG. 9. Referring to FIG. 8, a dummy dielectriclayer 214, a dummy electrode layer 216, and a gate-top hard mask layer218 may be blanketly deposited over the workpiece 200. In someembodiments, the dummy dielectric layer 214 may be deposited on thefin-shaped structure 210 using a chemical vapor deposition (CVD)process, an ALD process, or other suitable processes. In some instances,the dummy dielectric layer 214 may include silicon oxide. Thereafter,the dummy electrode layer 216 may be deposited over the dummy dielectriclayer 214 using a CVD process, an ALD process, or other suitableprocesses. In some instances, the dummy electrode layer 216 may includepolysilicon. For patterning purposes, the gate-top hard mask layer 218may be deposited on the dummy electrode layer 216 using a CVD process,an ALD process, or other suitable processes. The gate-top hard masklayer 218, the dummy electrode layer 216 and the dummy dielectric layer214 may then be patterned to form the dummy gate stack 220, as shown inFIG. 9. For example, the patterning process may include a lithographyprocess (e.g., photolithography or e-beam lithography) which may furtherinclude photoresist coating (e.g., spin-on coating), soft baking, maskaligning, exposure, post-exposure baking, photoresist developing,rinsing, drying (e.g., spin-drying and/or hard baking), other suitablelithography techniques, and/or combinations thereof. In someembodiments, the etching process may include dry etching (e.g., RIEetching), wet etching, and/or other etching methods. In someembodiments, the gate-top hard mask layer 218 may include a siliconoxide layer and a silicon nitride layer.

Referring to FIGS. 1 and 10, method 100 includes a block 114 where agate spacer layer 222 is deposited over the dummy gate stack 220. Insome embodiments, the gate spacer layer 222 is deposited conformallyover the workpiece 200, including over top surfaces and sidewalls of thedummy gate stack 220. The term “conformally” may be used herein for easeof description of a layer having substantially uniform thickness overvarious regions. The gate spacer layer 222 may have a single-layerconstruction or include multiple layers. In some embodiments representedin FIG. 10, the gate spacer layer 222 may include silicon carbonitride,silicon oxycarbide, silicon oxycarbonitride, or silicon nitride. Thegate spacer layer 222 may be deposited over the dummy gate stack 220using processes such as, a CVD process, a subatmospheric CVD (SACVD)process, an ALD process, or other suitable process.

Referring to FIGS. 1 and 10, method 100 includes a block 116 where asource/drain region 210SD of the fin-shaped structure 210 is recessed toform a source/drain trench 224. In some embodiments, the source/drainregions 210SD that are not covered by the dummy gate stack 220 areetched by a dry etch or a suitable etching process to form thesource/drain trenches 224. For example, the dry etch process mayimplement an oxygen-containing gas, a fluorine-containing gas (e.g.,CF₄, SF₆, CH₂F₂, CHF₃, and/or C₂F₆), a chlorine-containing gas (e.g.,Cl₂, CHCl₃, CCl₄, and/or BCl₃), a bromine-containing gas (e.g., HBrand/or CHBR₃), an iodine-containing gas, other suitable gases and/orplasmas, and/or combinations thereof. In some embodiments represented inFIG. 10, the source/drain regions 210SD of the fin-shaped structure 210are recessed to expose sidewalls of the sacrificial layers 206 and thechannel layers 208. In some implementations, the source/drain trenches224 extend below the stack 204 into the substrate 202. At block 116,portions of the gate spacer layer 222 over the source/drain regions210SD are etched away while portions of the gate spacer layer 222extending along sidewalls of the dummy gate stacks 220 remain. As shownin FIG. 10, the sacrificial layers 206 and channel layers 208 in thesource/drain region 210SD are removed at block 116, exposing thesubstrate 202.

Referring to FIGS. 1 and 11, method 100 includes a block 118 where innerspacer features 226 are formed. While not shown explicitly, operation atblock 118 may include selective and partial removal of the sacrificiallayers 206 to form inner spacer recesses, deposition of inner spacermaterial over the workpiece, and etch back the inner spacer material toform inner spacer features 226 in the inner spacer recesses. Thesacrificial layers 206 exposed in the source/drain trenches 22 areselectively and partially recessed to form inner spacer recesses(occupied by the inner spacer features 226 in FIG. 11) while the gatespacer layer 222, the exposed portion of the substrate 202, and thechannel layers 208 are substantially unetched. In an embodiment wherethe channel layers 208 consist essentially of silicon (Si) andsacrificial layers 206 consist essentially of silicon germanium (SiGe),the selective and partial recess of the sacrificial layers 206 mayinclude a SiGe oxidation process followed by a SiGe oxide removal. Inthat embodiments, the SiGe oxidation process may include use of ozone.In some other embodiments, the selective recess may be a selectiveisotropic etching process (e.g., a selective dry etching process or aselective wet etching process), and the extent at which the sacrificiallayers 206 are recessed is controlled by duration of the etchingprocess. The selective dry etching process may include use of one ormore fluorine-based etchants, such as fluorine gas orhydrofluorocarbons. The selective wet etching process may include ahydro fluoride (HF) or NH₄OH etchant.

The inner spacer material for the inner spacer features 226 may includemetal oxides, silicon oxide, silicon oxycarbonitride, silicon nitride,silicon oxynitride, carbon-rich silicon carbonitride, or a low-kdielectric material. The metal oxides here may include aluminum oxide,zirconium oxide, tantalum oxide, yttrium oxide, titanium oxide,lanthanum oxide, or other suitable metal oxide. While not explicitlyshown, the inner spacer material may be a single layer or a multilayer.In some implementations, the inner spacer material for the inner spacerfeatures 226 may be deposited using CVD, PECVD, SACVD, ALD or othersuitable methods. The inner spacer material for the inner spacerfeatures 226 is deposited into the inner spacer recesses as well as overthe sidewalls of the channel layers 208 exposed in the source/draintrenches 224. The deposited inner spacer material is then etched back toremove the inner spacer material from the sidewalls of the channellayers 208 to form the inner spacer features 226 in the inner spacerrecesses. At block 118, the inner spacer material may also be removedfrom the top surfaces and/or sidewalls of the gate-top hard mask layer218, the gate spacer layer 222, and the isolation features 212. In someimplementations, the etch back operations performed at block 118 mayinclude use of hydrogen fluoride (HF), fluorine gas (F₂), hydrogen (H₂),ammonia (NH₃), nitrogen trifluoride (NF₃), or other fluorine-basedetchants. As shown in FIG. 11, each of the inner spacer features 226 isin direct contact with the recessed sacrificial layers 206 and isdisposed between two neighboring channel layers 208.

Referring to FIGS. 1 and 12, method 100 includes a block 120 wheresource/drain features 228 are formed in the source/drain trench 224. Insome implementations, the source/drain features 228 may be epitaxiallyand selectively formed from the exposed sidewalls of the channel layers208 and exposed surfaces of the substrate 202. Sidewalls of thesacrificial layers 206 remain covered by the inner spacer features 226.Suitable epitaxial processes for block 120 include CVD depositiontechniques (e.g., vapor-phase epitaxy (VPE) and/or ultra-high vacuum CVD(UHV-CVD)), molecular beam epitaxy (MBE), and/or other suitableprocesses. The epitaxial growth process at block 120 may use gaseousand/or liquid precursors, which interact with the composition of thesubstrate 202 as well as the channel layers 208. In some embodiments,parameters of the epitaxial growth process at block 120 are selectedsuch that the source/drain features 228 are not epitaxially deposited onthe inner spacer features 226. In those embodiments, overgrowth of thesource/drain features 228 from the channel layers 208 and substrate 202may merge over the inner spacer features 226. Depending on types oftransistors to be formed on the workpiece 200, the source/drain features228 may be n-type or p-type. When the source/drain feature 228 isn-type, the source/drain features 228 may include silicon (Si) and maybe doped with an n-type dopant, such as phosphorus (P), arsenic (As), orantimony (Sb). When the source/drain feature 228 is p-type, thesource/drain features 228 may include silicon (Si), germanium (Ge),germanium tin (GeSn) or silicon germanium (SiGe) and may be doped with ap-type dopant, such as boron (B) or gallium (Ga).

Referring to FIGS. 1 and 13, method 100 includes a block 122 wherefurther processes are performed. Such further processes may include, forexample, deposition of a contact etch stop layer (CESL) 230 over theworkpiece 200, deposition of an interlayer dielectric (ILD) layer 232over the CESL 230, removal of the dummy gate stack 220, selectiveremoval of the sacrificial layers 206 in the channel region 210C torelease the channel layers 208 as channel members 2080, and formation ofa gate structure 238 over the channel region 210C. Referring now to FIG.13, the CESL 230 is formed prior to forming the ILD layer 232. In someexamples, the CESL 230 includes a silicon nitride layer, a silicon oxidelayer, a silicon oxynitride layer, and/or other materials known in theart. The CESL 230 may be formed by ALD, plasma-enhanced chemical vapordeposition (PECVD) process and/or other suitable deposition or oxidationprocesses. The ILD layer 232 is then deposited over the CESL 230. Insome embodiments, the ILD layer 232 includes materials such astetraethylorthosilicate (TEOS) oxide, un-doped silicate glass, or dopedsilicon oxide such as borophosphosilicate glass (BPSG), fused silicaglass (FSG), phosphosilicate glass (PSG), boron doped silicon glass(BSG), and/or other suitable dielectric materials. The ILD layer 232 maybe deposited by CVD, spin-on coating, or other suitable depositiontechnique. In some embodiments, after formation of the ILD layer 232,the workpiece 200 may be annealed to improve integrity of the ILD layer232. As shown in FIG. 13, the CESL 230 may be disposed directly on topsurfaces of the source/drain feature 228.

After the deposition of the CESL 230 and the ILD layer 232, theworkpiece 200 may be planarized by a planarization process to expose thedummy gate stack 220 (shown in FIG. 12). For example, the planarizationprocess may include a chemical mechanical planarization (CMP) process.Exposure of the dummy gate stack 220 allows the removal of the dummygate stack 220 and release of the channel layers 208. In someembodiments, the removal of the dummy gate stack 220 results in a gatetrench over the channel regions 210C. The removal of the dummy gatestack 220 may include one or more etching processes that are selectiveto the material of the dummy gate stack 220. For example, the removal ofthe dummy gate stack 220 may be performed using as a selective wet etch,a selective dry etch, or a combination thereof that is selective to thedummy gate stack 220. After the removal of the dummy gate stack 220,sidewalls of the channel layers 208 and the sacrificial layers 206 inthe channel region 210C are exposed in the gate trench.

After the removal of the dummy gate stack 220, the method 100 mayinclude operations to selectively remove the sacrificial layers 206between the channel layers 208 in the channel region 210C. The selectiveremoval of the sacrificial layers 206 releases the channel layers 208 toform channel members 2080. The selective removal of the sacrificiallayers 206 may be implemented by selective dry etch, selective wet etch,or other selective etch processes. In some embodiments, the selectivewet etching includes an APM etch (e.g., ammonia hydroxide-hydrogenperoxide-water mixture). In some embodiments where the sacrificiallayers 206 are formed of silicon germanium, the selective removalincludes silicon germanium oxidation followed by a silicon germaniumoxide removal. For example, the oxidation may be provided by ozone cleanand then silicon germanium oxide removed by an etchant such as NH₄OH.

The method 100 may include further operations to form the gate structure238 to wrap around each of the released channel members 2080. In someembodiments, the gate structure 238 is formed within the gate trench andinto the space left behind by the removal of the sacrificial layers 206to wrap around each of the channel members 2080. In various embodiments,the gate structure 238 includes a gate dielectric layer 234 and a gateelectrode layer 236 formed over the gate dielectric layer 234. While notexplicitly shown, the gate dielectric layer 234 includes an interfaciallayer on the channel members 2080 and a high-k dielectric layer over theinterfacial layer. Here, high-K dielectric materials, as used anddescribed herein, include dielectric materials having a high dielectricconstant, for example, greater than that of thermal silicon oxide(˜3.9). The interfacial layer may include silicon oxide or hafniumsilicate. The interfacial layer may be formed by chemical oxidation,cleaning, thermal oxidation, atomic layer deposition (ALD), and/or othersuitable method. The high-K gate dielectric layer may include hafniumoxide. Alternatively, the high-K gate dielectric layer may include otherhigh-K dielectric materials, such as titanium oxide (TiO₂), hafniumzirconium oxide (HfZrO), tantalum oxide (Ta₂O₅), hafnium silicon oxide(HfSiO₄), zirconium oxide (ZrO₂), zirconium silicon oxide (ZrSiO₂),lanthanum oxide (La₂O₃), aluminum oxide (Al₂O₃), zirconium oxide (ZrO),yttrium oxide (Y₂O₃), SrTiO₃ (STO), BaTiO₃ (BTO), BaZrO, hafniumlanthanum oxide (HfLaO), lanthanum silicon oxide (LaSiO), aluminumsilicon oxide (AlSiO), hafnium tantalum oxide (HfTaO), hafnium titaniumoxide (HfTiO), (Ba,Sr)TiO₃ (BST), silicon nitride (SiN), siliconoxynitride (SiON), combinations thereof, or other suitable material. Thehigh-K gate dielectric layer may be formed by ALD, physical vapordeposition (PVD), CVD, oxidation, and/or other suitable methods.

The gate electrode layer 236 of the gate structure 238 may include asingle layer or alternatively a multi-layer structure, such as variouscombinations of a metal layer with a selected work function to enhancethe device performance (work function metal layer), a liner layer, awetting layer, an adhesion layer, a metal alloy or a metal silicide. Byway of example, the gate electrode layer 236 of the gate structure 238may include titanium nitride (TiN), titanium aluminum (TiAl), titaniumaluminum nitride (TiAlN), tantalum nitride (TaN), tantalum aluminum(TaAl), tantalum aluminum nitride (TaAlN), tantalum aluminum carbide(TaAlC), tantalum carbonitride (TaCN), aluminum (Al), tungsten (W),nickel (Ni), titanium (Ti), ruthenium (Ru), cobalt (Co), platinum (Pt),tantalum carbide (TaC), tantalum silicon nitride (TaSiN), copper (Cu),other refractory metals, or other suitable metal materials or acombination thereof. In various embodiments, the gate electrode layer236 of the gate structure 238 may be formed by ALD, PVD, CVD, e-beamevaporation, or other suitable process. Further, the gate electrodelayer 236 may be formed separately for n-type and p-type transistorswhich may use different metal layers (e.g., for providing differentn-type and p-type work function metal layers). In various embodiments, aCMP process may be performed to remove excessive metal, therebyproviding a substantially planar top surface of the gate structure 238.The gate structure 238 includes portions that interpose between channelmembers 2080 in the channel region 210C. Upon conclusion of operation atblock 122, an MBC transistor 240 is formed. Depending on the design ofthe semiconductor device 200, the MBC transistor 240 may be n-type orp-type.

Although not intended to be limiting, one or more embodiments of thepresent disclosure provide methods for reducing the number or dimensionsof germanium humps when a stack having a germanium-containing top layeris patterned to form a fin-shaped structure. Such methods may includeforming a pad oxide layer using a low-level of oxygen plasma, forming apad nitride layer using plasma-enhanced atomic layer deposition (PEALD)or plasma-enhanced chemical vapor deposition (PECVD) at a lowtemperature for a short period of time, or a combination thereof. Use oflow-level oxygen plasma may lessen germanium oxide, which is a reactantin a reduction chemical reaction to form germanium precipitation. Thelow temperature and short process time during the formation of the padnitride layer may decrease thermal energy input and slow down reductionreaction of germanium oxide to form germanium. By lessening germaniumoxide formation and/or slowing down the reduction reaction of germaniumoxide, method of the present disclosure may decrease germaniumprecipitation, thereby improving uniformity of fin-shaped structures andoverall yield.

In one exemplary aspect, the present disclosure is directed to a method.The method includes receiving a workpiece including a stack ofsemiconductor layers, the stack including a germanium-containing toplayer, depositing a first pad oxide layer on the germanium-containingtop layer, depositing a second pad oxide layer on the first pad oxidelayer, depositing a pad nitride layer on the second pad oxide layer, andpatterning the stack using the first pad oxide layer, the second padoxide layer, and the pad nitride layer as a hard mask layer. Thedepositing of the first pad oxide layer includes a first oxygen plasmapower. The depositing of the second pad oxide layer includes a secondoxygen plasma power greater than the first oxygen plasma power.

In some embodiments, a ratio of the second oxygen plasma power to thefirst oxygen plasma power is between about 2 and about 3. In someimplementations, a thickness in the first pad oxide layer is identicalto a thickness in the second pad oxide layer. In some instances, thefirst pad oxide layer includes a thickness between about 8 Å and about12 Å and the second pad oxide layer includes a thickness between about 8Å and about 12 Å. In some embodiments, the depositing of the pad nitridelayer includes use of plasma-enhanced atomic layer deposition (PEALD) orplasma-enhanced chemical vapor deposition (PECVD). In some instances,the depositing of the pad nitride layer includes a process temperaturebetween about 350° C. and about 450° C. In some implementations, thedepositing of the pad nitride layer includes a duration between about 25minutes and about 35 minutes.

In another exemplary aspect, the present disclosure is directed to amethod. The method includes receiving a workpiece including a stack ofsemiconductor layers, wherein a top layer of the stack includesgermanium, depositing a first pad oxide layer on the top layer,depositing a pad nitride layer over the first pad oxide layer, whereinthe depositing of the pad nitride layer includes use of plasma-enhancedatomic layer deposition (PEALD) or plasma-enhanced chemical vapordeposition (PECVD) and a process temperature between about 350° C. andabout 450° C., and patterning the stack using at least the first padoxide layer and the pad nitride layer as a hard mask layer.

In some embodiments, the depositing of the pad nitride layer includes aduration between about 25 minutes and about 35 minutes. In someimplementations, the top layer includes germanium or silicon germanium.In some instances, the depositing of the first pad oxide layer includesa first oxygen plasma power between about 550 Watts and about 800 Watts.In some embodiments, the method may further include before thedepositing of the pad nitride layer, depositing a second pad oxide layeron the first pad oxide layer. The depositing of the second pad oxidelayer includes a second oxygen plasma power. A ratio of the secondoxygen plasma power to the first oxygen plasma power is between about 2and about 3. In some instances, a thickness in the first pad oxide layeris identical to a thickness in the second pad oxide layer. In someimplementations, the first pad oxide layer includes a thickness betweenabout 8 Å and about 12 Å and the second pad oxide layer includes athickness between about 8 Å and about 12 Å.

In yet another exemplary aspect, the present disclosure is directed to amethod. The method includes receiving a workpiece including a stack ofsemiconductor layers, wherein a top layer of the stack includes silicongermanium, depositing a first pad oxide layer on the top layer,depositing a second pad oxide layer on the first pad oxide layer,depositing a pad nitride layer on the second pad oxide layer, andpatterning the stack to form a fin-shaped structure, where thepatterning includes use of the first pad oxide layer, the second padoxide layer, and the pad nitride layer as a hard mask layer. Thedepositing of the pad nitride layer includes use of plasma-enhancedatomic layer deposition (PEALD) or plasma-enhanced chemical vapordeposition (PECVD) and a process temperature between about 350° C. andabout 450° C.

In some embodiments, the depositing of the pad nitride layer includes aduration between about 25 minutes and about 35 minutes. In someimplementations, an etch rate of the first pad oxide layer in dilutedhydrogen fluoride (DHF) is greater than an etch rate of the second padoxide layer in DHF. In some instances, the depositing of the first padoxide layer includes a first oxygen plasma power and the depositing ofthe second pad oxide layer includes a second oxygen plasma power greaterthan the first oxygen plasma power. In some embodiments, a ratio of thesecond oxygen plasma power to the first oxygen plasma power is betweenabout 2 and about 3. In some instances, a thickness in the first padoxide layer is identical to a thickness in the second pad oxide layer.

The foregoing outlines features of several embodiments so that those ofordinary skill in the art may better understand the aspects of thepresent disclosure. Those of ordinary skill in the art should appreciatethat they may readily use the present disclosure as a basis fordesigning or modifying other processes and structures for carrying outthe same purposes and/or achieving the same advantages of theembodiments introduced herein. Those of ordinary skill in the art shouldalso realize that such equivalent constructions do not depart from thespirit and scope of the present disclosure, and that they may makevarious changes, substitutions, and alterations herein without departingfrom the spirit and scope of the present disclosure.

What is claimed is:
 1. A method, comprising: receiving a workpiececomprising a stack of semiconductor layers, the stack comprising agermanium-containing top layer; after the receiving, depositing a firstpad oxide layer directly on the germanium-containing top layer; afterthe depositing of the first pad oxide layer, depositing a second padoxide layer directly on the first pad oxide layer; after the depositingof the second pad oxide layer, depositing a pad nitride layer directlyon the second pad oxide layer; and patterning the stack using the firstpad oxide layer, the second pad oxide layer, and the pad nitride layeras a hard mask layer, wherein the depositing of the first pad oxidelayer comprises a first oxygen plasma power, wherein the depositing ofthe second pad oxide layer comprises a second oxygen plasma powergreater than the first oxygen plasma power.
 2. The method of claim 1,wherein a ratio of the second oxygen plasma power to the first oxygenplasma power is between about 2 and about
 3. 3. The method of claim 1,wherein a thickness in the first pad oxide layer is identical to athickness in the second pad oxide layer.
 4. The method of claim 1,wherein the first pad oxide layer comprises a thickness between about 8Å and about 12 Å, wherein the second pad oxide layer comprises athickness between about 8 Å and about 12 Å.
 5. The method of claim 1,wherein the depositing of the pad nitride layer comprises use ofplasma-enhanced atomic layer deposition (PEALD) or plasma-enhancedchemical vapor deposition (PECVD).
 6. The method of claim 1, wherein thedepositing of the pad nitride layer comprises a process temperaturebetween about 350° C. and about 450° C.
 7. The method of claim 1,wherein the depositing of the pad nitride layer comprises a durationbetween about 25 minutes and about 35 minutes.
 8. A method, comprising:receiving a workpiece comprising a stack of semiconductor layers,wherein a top layer of the stack comprises germanium; depositing a firstpad oxide layer on the top layer, wherein the depositing of the firstpad oxide layer comprises a first oxygen plasma power between about 550Watts and about 800 Watts; depositing a pad nitride layer over the firstpad oxide layer, wherein the depositing of the pad nitride layercomprises use of plasma-enhanced atomic layer deposition (PEALD) orplasma-enhanced chemical vapor deposition (PECVD) and a processtemperature between about 350° C. and about 450° C.; and patterning thestack using at least the first pad oxide layer and the pad nitride layeras a hard mask layer.
 9. The method of claim 8, wherein the depositingof the pad nitride layer comprises a duration between about 25 minutesand about 35 minutes.
 10. The method of claim 8, wherein the top layercomprises germanium or silicon germanium.
 11. The method of claim 8,further comprising: before the depositing of the pad nitride layer,depositing a second pad oxide layer on the first pad oxide layer,wherein the depositing of the second pad oxide layer comprises a secondoxygen plasma power, wherein a ratio of the first oxygen plasma power tothe second oxygen plasma power is between about 2 and about
 3. 12. Themethod of claim 11, wherein a thickness in the first pad oxide layer isidentical to a thickness in the second pad oxide layer.
 13. The methodof claim 11, wherein the first pad oxide layer comprises a thicknessbetween about 8 Å and about 12 Å, wherein the second pad oxide layercomprises a thickness between about 8 Å and about 12 Å.
 14. A method,comprising: receiving a workpiece comprising a stack of semiconductorlayers, wherein a top layer of the stack comprises silicon germanium;depositing a first pad oxide layer on the top layer; depositing a secondpad oxide layer on the first pad oxide layer; depositing a pad nitridelayer on the second pad oxide layer; and patterning the stack to form afin-shaped structure, where the patterning comprises use of the firstpad oxide layer, the second pad oxide layer, and the pad nitride layeras a hard mask layer, wherein the depositing of the pad nitride layercomprises use of plasma-enhanced atomic layer deposition (PEALD) orplasma-enhanced chemical vapor deposition (PECVD) and a processtemperature between about 350° C. and about 450° C., wherein an etchrate of the first pad oxide layer in diluted hydrogen fluoride (DHF) isgreater than an etch rate of the second pad oxide layer in DHF.
 15. Themethod of claim 14, wherein the depositing of the pad nitride layercomprises a duration between about 25 minutes and about 35 minutes. 16.The method of claim 14, wherein the depositing of the first pad oxidelayer comprises a first oxygen plasma power, wherein the depositing ofthe second pad oxide layer comprises a second oxygen plasma powergreater than the first oxygen plasma power.
 17. The method of claim 16,wherein a ratio of the second oxygen plasma power to the first oxygenplasma power is between about 2 and about
 3. 18. The method of claim 16,wherein a thickness in the first pad oxide layer is identical to athickness in the second pad oxide layer.
 19. The method of claim 1,wherein the first pad oxide layer and the second pad oxide layercomprise silicon oxide.
 20. The method of claim 11, wherein the firstpad oxide layer and the second pad oxide layer comprise silicon oxide,wherein the depositing of the pad nitride layer comprises depositing thepad nitride layer directly on the second pad oxide layer.